Mentor Introduces Unique End-to-End Xpedition High Density Advanced Packaging Flow

· The Mentor® Xpedition® High Density Advanced Packaging (HDAP) flow is the industry’s first comprehensive solution for the design and verification of today’s most advanced IC packages.

· The industry-unique Xpedition Substrate Integrator tool enables rapid prototyping of heterogeneous substrate packaged components.

· New Xpedition Package Design technology implemented for physical packages ensures that design signoffs are synchronized with validated data.

· Integrated Mentor HyperLynx® technology provides 2.5D/3D simulation models and design rule checking (DRC) to accurately identify and resolve design errors prior to tapeout.

· Calibre® 3DSTACK technology enables complete signoff verification for a variety of 2.5D and 3D stacked chip assemblies.

Mentor, a Siemens business, today announced the industry’s most comprehensive and efficient solution for advanced IC packaging design – the Xpedition® High Density Advanced Packaging (HDAP) process. This comprehensive end-to-end solution combines Mentor® Xpedition, HyperLynx® and Calibre® technologies for rapid prototyping and GDS Signoff. The new Mentor IC package design flow provides faster, higher-quality results than existing HDAP methods and techniques. The Xpedition HDAP design environment provides earlier, faster, and accurate “what-if” prototyping evaluations in hours, equivalent to days or weeks of work with existing tools and processes, enabling customers to explore and implement Optimize HDAP design.

With the rise of advanced packaging technologies such as Fan-Out Wafer-Level Packaging (FOWLP), the convergence of IC design and packaging design is becoming more apparent. This poses extraordinary challenges to existing traditional design methods and calls for new and more efficient processes, methods and design tools. Existing tools are often inefficient or completely unusable when moving from design to manufacturing. Mentor’s unique HDAP solution has successfully solved this problem. The solution includes integrated prototyping of multilayer substrates and detailed physical implementation with Foundry/OSAT level verification and Signoff.

“FOWLP is expected to grow by a staggering 82 percent between 2015 and 2020,” said Jan Vardaman, president of TechSearch International. “However, FOWLP disrupts traditional design and manufacturing supply chains. Like other high-density advanced packaging technologies , which will drive demand for device and package co-design and new processes such as the Mentor HDAP solution.”

Unique HDAP integration, prototyping and package design technology

The new HDAP process introduces two unique technologies. The first is the Xpedition Substrate Integrator tool, a graphical, rapid virtual prototyping environment capable of exploring and integrating heterogeneous ICs with interposers, packages, and PCBs. Using a rules-based approach to optimize connectivity, performance, and manufacturability, it provides rapid and predictable component prototyping for entire cross-domain substrate systems. The second new technology is the Xpedition Package Designer tool, a complete HDAP design-to-mask-ready GDS output solution capable of managing the physical implementation of the package. The Xpedition Package Designer tool uses built-in HyperLynx Design Rule Checking (DRC) for detailed in-design checking prior to signoff, and the HyperLynx FAST3D package parser provides package model creation. Integrate directly with Calibre tools and then provide Process Design Kit (PDK) Signoff.

Integrated HyperLynx® technology for in-design inspection

The Xpedition HDAP flow integrates with two Mentor HyperLynx technologies for 3D Signal Integrity (SI)/Power Integrity (PI), and in-flow Design Rule Checking (DRC). Package designers can use the HyperLynx FAST 3D field parser for extraction and analysis for SI/PI 3D model simulation. The HyperLynx DRC tool easily identifies and resolves DRC errors at the substrate level, typically finding 80%-90% of the issues before final tapeout and signoff verification.

Calibre® 3DSTACK Technology

When integrated with the Xpedition Package Designer tool, Calibre 3DSTACK technology provides 2.5D/3D package physical verification. IC package designers can perform Design Rule Checks (DRC) and Layout and Schematic (LVS) checks of entire multi-chip systems at any process node without breaking existing tool flows or requiring new data formats, dramatically reducing Streaming time.

OSAT Affiliate Program

Mentor also introduced the Outsourced Assembly and Test (OSAT) Alliance Program, a global design and supply chain resource that makes it easier for fabless customers to adopt emerging HDAP technologies. The OSAT Affiliate Program contains proven design flows, tool kits, and best practice recommendations for Validation and Signoff processes to create HDAP projects that deliver the highest quality results.

“Mentor’s new Xpedition HDAP solution combines proven industry-leading technologies from Xpediton, HyperLynx and Calibre,” said AJ Incorvaia, Vice President and General Manager, Mentor BSD. Ability to combine foundry and OSAT design and manufacturing Signoff support. The Xpedition HDAP flow provides customers with a unified design and verification environment for foundry Signoff-ready designs.”

get product

The Xpedition HDAP solution is available now. For additional product information, visit the website: https://www.mentor.com/pcb/ic-packaging. Mentor will be hosting the Xpedition HDAP Process Technology Conference at the Design Automation Conference June 19-22, 2017 in Austin, Texas. To register, visit: https://www.mentor.com/events/design-automation-conference/focus/pcb

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